Intel is exploring revolutionary direct CPU water cooling by integrating a waterblock onto the CPU package itself, enabling the dissipation of up to 1,000W of thermal energy. This innovation could eliminate the need for separate cooling components and enhance thermal performance by 15-20% compared to conventional systems. With prototypes showcased for gaming and server CPUs, this technology may redefine cooling in high-performance setups.
How might the integration of direct cooling impact the design and efficiency of future CPUs in both consumer and enterprise markets?
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