AMD is gearing up to introduce an innovative “3D core” in its upcoming Zen 7 architecture, which is expected to launch around late 2027 or early 2028. This design features multiple cache slices stacked beneath a high number of CPU cores, potentially revolutionizing performance by enhancing cache access and reducing latency. Key details include the cores being manufactured with TSMC’s cutting-edge 1.4nm technology, while the 3D V-cache may still use the 4nm process. This architecture aims for a significant boost in instructions per clock, potentially leapfrogging Intel’s offerings.
Given the promising yet speculative nature of these advancements, how do you think AMD’s focus on 3D stacking technology will shape the competitive landscape of CPU architecture in the next few years?
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